Mechanically Exfoliated HfS₂ FET Device

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    Mechanically Exfoliated HfS₂ FET Device

    Device Structure:
    Au Electrodes / HfS₂ / 300 nm SiO₂ / Si Back-Gated FET

    HfS₂ Layer Options:
    Few-layer (~5 layers)
    Multilayer (~10 layers)
    For specific thickness requirements, please contact us.

    Device Description & Features:
    High-Mobility 2D Semiconductor: Hafnium disulfide (HfS₂) is a layered transition metal dichalcogenide (TMD) with high electron mobility, making it a promising material for next-generation field-effect transistors (FETs). Back-Gated Configuration: The SiO₂/Si back-gate structure enables efficient gate control over the channel conductivity, facilitating low-power and high-performance electronic applications.
    Mechanically Exfoliated Layers: Ensures high-quality, defect-free HfS₂ films with well-preserved intrinsic electronic properties.
    Gold Electrodes: Ohmic contacts for efficient charge injection, optimizing device performance.
    Tunable Thickness: Different layer numbers allow for studying thickness-dependent electronic properties.

    Applications:
    High-Performance Field-Effect Transistors (FETs):
    HfS₂-based FETs exhibit high carrier mobility and excellent gate tunability. Flexible and Low-Power Electronics:
    Thin-film HfS₂ FETs are ideal for wearable and flexible electronic devices. Optoelectronic Devices:
    HfS₂ exhibits a tunable bandgap and strong light absorption, making it suitable for photodetectors. Quantum & Neuromorphic Computing:
    Potential use in low-dimensional quantum transport studies and next-generation neuromorphic computing architectures.

    Option 1

    Few-layer (~5 layers), Multilayer (~10 layers)