Copper-Coated Silicon Wafers (Cu/Ti on Si (100))
Cu-Coated Si

Copper-Coated Silicon Wafers (Cu/Ti on Si (100))

Price range: £142.99 through £478.99

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    Copper-Coated Silicon Wafers (Cu/Ti on Si (100))

    Overview
    Our copper-coated silicon wafers are fabricated using high-vacuum magnetron sputtering to ensure uniform thickness, strong adhesion, and clean surface morphology suitable for electrochemical research and microfabrication.

    A titanium (Ti) adhesion layer is deposited between the silicon substrate and the copper film to enhance interfacial bonding and long-term film stability.

    These Cu-coated wafers are widely used in CO₂ reduction research, electrochemical studies, electrode development, seed layer applications, and thin film device fabrication.

    Layer Structure
    Cu (Copper layer)
    Ti (10 nm adhesion layer)
    Si (100) substrate

    Adhesion Layer
    Standard adhesion layer: Ti (10 nm)
    This configuration provides reliable adhesion while maintaining good electrical conductivity.
    Optional adhesion thickness available upon request.

    Recommended Copper Thickness
    Standard thickness options:
    50 nm–Thin conductive layer / seed layer
    100 nm–Recommended (general electrochemical research)
    200 nm – Recommended (improved stability & durability)
    500 nm – Thick conductive layer

    Custom thickness available upon request.

    Substrate Specifications
    Standard configuration (default)
    Orientation: Si (100)
    Doping: N-type, 1–10 Ω·cm resistivity
    Surface finish: Single-side polished (SSP)

    Custom options available upon request:
    P-type silicon
    Double-side polished (DSP)
    Custom resistivity range

    Deposition Process
    High-vacuum magnetron sputtering
    Controlled thickness uniformity
    Clean-room compatible handling

    Applications
    CO₂ reduction reaction (CO2RR)
    Electrochemical catalysis research
    Electrode platform development
    Seed layer for electroplating
    Microelectronic interconnect research
    MEMS fabrication

    Quality & Packaging
    Uniform film thickness control
    Research-grade surface quality
    Protective packaging to minimize oxidation exposure

    Custom Orders
    We support:
    Custom wafer diameter
    Custom copper thickness
    Custom adhesion thickness
    Patterned copper upon request

    Contact us for academic pricing and technical consultation.

    Option 1

    2″ Si | 100 nm Cu, 2″ Si | 200 nm Cu, 2″ Si | 50 nm Cu, 2″ Si | 500 nm Cu, 4″ Si | 100 nm Cu, 4″ Si | 200 nm Cu, 4″ Si | 50 nm Cu, 4″ Si | 500 nm Cu, 6″ Si | 100 nm Cu, 6″ Si | 200 nm Cu, 6″ Si | 50 nm Cu, 6″ Si | 500 nm Cu, 8″ Si | 100 nm Cu, 8″ Si | 200 nm Cu

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