Platinum-Coated Silicon Wafers (Pt/Ti on Si (100))

Price range: £286.99 through £1,318.99

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    Platinum-Coated Silicon Wafers (Pt/Ti on Si (100))
    Overview
    Our platinum-coated silicon substrates are fabricated using high-vacuum magnetron sputtering to ensure uniform thickness, excellent adhesion, and high surface quality suitable for advanced research and device fabrication.
    A titanium (Ti) adhesion layer is deposited between the silicon substrate and the platinum layer to provide strong interfacial bonding and long-term stability.
    These substrates are widely used in electrochemical research, catalysis studies, fuel cell development, and MEMS fabrication.

    Layer Structure
    Standard structure:
    Pt (Platinum layer)
    Ti (10 nm adhesion layer)
    Si (100) Wafer

    Adhesion Layer
    Standard adhesion layer: Ti (10 nm)
    This configuration is widely used in electrochemical and microfabrication applications due to its strong adhesion and stable interface.

    Optional: Ti (20 nm)
    Recommended for thicker Pt films (>500 nm) or high-temperature applications.

    Custom adhesion thickness available upon request.

    Platinum Thickness Options
    Standard Pt thickness:
    50 nm
    100 nm
    200 nm
    500 nm

    Custom thickness available upon request.

    Substrate Specifications
    Standard configuration (default)
    Orientation: Si (100)
    Doping: N-type, 1–10 Ω·cm resistivity
    Surface finish: Single-side polished (SSP)
    This configuration is commonly used in laboratory research and device prototyping.

    Custom options available
    P-type silicon
    Double-side polished (DSP)
    Custom resistivity
    Please contact us for special requirements or bulk orders.

    Deposition Process
    High-vacuum magnetron sputtering
    Controlled deposition ensures good thickness uniformity and reliable electrical performance.

    Applications
    Electrochemical catalysis (HER, OER, CO2RR)
    Fuel cell electrode platforms
    Hydrogen evolution studies
    High-temperature electrode systems
    MEMS sensors
    Microelectrode fabrication
    Catalytic surface research
    Quality & Packaging
    Uniform film thickness control
    Clean-room compatible handling
    Protective packaging to prevent contamination
    Research-grade surface quality

    Why Choose Our Pt/Ti on Si Substrates?
    Research-grade platinum thin films
    Optimized Ti adhesion layer
    Stable electrochemical performance
    Competitive direct-manufacturer pricing

    Custom Orders
    We support:
    Custom wafer size
    Custom Pt thickness
    Patterned platinum upon request

    Contact us for academic pricing and technical consultation.

    Option 1

    12″ Si | 100 nm Pt, 12″ Si | 50 nm Pt, 2″ Si | 100 nm Pt, 2″ Si | 200 nm Pt, 2″ Si | 50 nm Pt, 2″ Si | 500 nm Pt, 4″ Si | 100 nm Pt, 4″ Si | 200 nm Pt, 4″ Si | 50 nm Pt, 4″ Si | 500 nm Pt, 6″ Si | 100 nm Pt, 6″ Si | 200 nm Pt, 6″ Si | 50 nm Pt, 6″ Si | 500 nm Pt, 8″ Si | 100 nm Pt, 8″ Si | 200 nm Pt, 8″ Si | 50 nm Pt, 8″ Si | 500 nm Pt