Platinum-Coated Silicon Substrates (Pt/Ti on Si (100))

Platinum-Coated Silicon Substrates (Pt/Ti on Si (100))
Overview

Our platinum-coated silicon chips are precision-cut from research-grade Pt/Ti on Si (100) wafers and fabricated using high-vacuum magnetron sputtering to ensure uniform thickness, strong adhesion, and high surface quality.
A titanium (Ti) adhesion layer is deposited between the silicon substrate and the platinum film to provide excellent interfacial bonding and long-term electrochemical stability.
These platinum-coated chips are ideal for electrochemical research, catalytic surface studies, and microelectrode development.

Each chip is fabricated with a standard Ti (10 nm) adhesion layer.

Custom size or thickness available upon request.

Layer Structure
Standard structure:
Pt (Platinum layer)
Ti (10 nm adhesion layer)
Si (100) substrate

Substrate Specifications
Standard configuration:
Orientation: Si (100)
Doping: N-type, 1–10 Ω·cm resistivity
Surface finish: Single-side polished (SSP)
Custom silicon type available upon request.

Deposition & Processing
High-vacuum magnetron sputtering
Controlled film thickness
Precision wafer dicing
Each chip is carefully cleaned and packaged to maintain surface quality.

Applications
Electrochemical catalysis (HER, OER, CO2RR)
Fuel cell electrode studies
Hydrogen evolution experiments
Microelectrode platforms
High-temperature electrode testing
Catalytic surface analysis

Quality & Packaging
Uniform film thickness control
Clean-room compatible handling
Individual protective packaging
Research-grade surface quality

Why Choose Our Platinum-Coated Chips?
Optimized for electrochemical applications
Stable and corrosion-resistant Pt surface
Compact and ready-to-use format
Competitive direct-manufacturer pricing

Custom Orders
We support:
Custom chip dimensions
Custom Pt thickness
Patterned platinum structures
Contact us for technical consultation and academic pricing.