Gold-Coated Silicon Substrates (Au/Ti on Si)
Au-Coated Si

Gold-Coated Silicon Substrates (Au/Ti on Si)

Price range: £34.99 through £214.99

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    Gold-Coated Silicon Substrates (Au/Ti on Si (100))
    Overview

    Our gold-coated silicon substrates are fabricated using high-vacuum magnetron sputtering or thermal evaporation to ensure uniform thickness, strong adhesion, and clean surface morphology suitable for research and device fabrication.
    A standard 10 nm titanium (Ti) adhesion layer is deposited between the silicon substrate and the gold layer to provide excellent film stability and long-term reliability.
    This product is ideal for electrochemical research, microfabrication, MEMS development, RF structures, and sensor platforms.

    Layer Structure
    Standard structure:
    Au (Gold layer)
    Ti (10 nm adhesion layer)
    Si (100) substrate

    Adhesion Layer
    Standard adhesion layer:
    Ti (10 nm)
    This configuration is widely used in research laboratories and microfabrication processes due to its excellent compatibility with Si/SiO₂ and stable performance in electrochemical environments.
    Custom adhesion thickness available upon request.

    Gold Thickness Options
    Standard Au thickness:
    50 nm
    100 nm
    500 nm
    Custom thickness available upon request.

    Substrate Specifications
    Standard configuration (default)
    Orientation: Si (100)
    Doping: N-type, 1–10 Ω·cm resistivity (phosphorus-doped)
    Surface finish: Single-side polished (SSP)
    This configuration is widely used in research laboratories, electrochemistry, and microfabrication.
    Custom options available upon request
    Doping: N-type or P-type
    Surface finish: SSP or DSP
    Custom resistivity range
    Please contact us for special requirements or bulk orders.

    Deposition Process
    High-vacuum magnetron sputtering
    Thermal evaporation (depending on thickness requirement)
    Controlled deposition ensures uniform thickness and strong adhesion across the silicon surface.

    Applications

    Microelectrode fabrication
    Electrochemical studies (HER, OER, CO2RR)
    MEMS device development
    RF and microwave structures
    Bonding pads
    Sensor and biosensor platforms
    Micro-patterned gold devices
    Quality & Packaging
    Uniform film thickness control
    Clean-room compatible handling
    Protective packaging to prevent contamination
    Research-grade surface quality

    Why Choose Our Au on Si Substrates?

    Research-grade quality
    Optimized thickness selection
    Competitive direct-manufacturer pricing
    Custom Orders
    We support:
    Custom wafer diameter
    Custom gold thickness
    Patterned gold upon request
    Contact us for technical consultation and academic pricing.

    Option 1

    10 × 10 mm Si | 100 nm Au, 10 × 10 mm Si | 50 nm Au, 10 × 10 mm Si | 500 nm Au, 15 × 15 mm Si | 100 nm Au, 15 × 15 mm Si | 50 nm Au, 20 × 20 mm Si | 100 nm Au, 20 × 20 mm Si | 50 nm Au, 5 × 5 mm Si | 100 nm Au, 5 × 5 mm Si | 50 nm Au, 5 × 5 mm Si | 500 nm Au

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