Nickel-Coated Silicon Wafers (Ni on Si (100))

Nickel-Coated Silicon Wafers (Ni on Si (100))

Overview
Our nickel-coated silicon wafers are fabricated using high-vacuum magnetron sputtering to ensure uniform thickness, strong adhesion, and stable surface quality suitable for electrochemical and materials research.

Nickel films are widely used in alkaline electrolysis, oxygen evolution reaction (OER), hydrogen evolution reaction (HER), and electrode development due to their excellent catalytic activity and corrosion resistance.

Layer Structure
Ni (Nickel layer)
Si (100) substrate

Optional adhesion layer available upon request:
Ti (5 nm)

Recommended Nickel Thickness
100 nm – * Recommended for general electrochemical research
200 nm – * Recommended for improved durability
500 nm – Thick conductive layer
1 µm – High-current or long-term testing applications

Substrate Specifications
Orientation: Si (100)
Doping: N-type, 1–10 Ω·cm resistivity
Surface finish: Single-side polished (SSP)

Custom options available upon request:
P-type silicon
Double-side polished (DSP)
Custom resistivity

Deposition Process
High-vacuum magnetron sputtering
Controlled thickness uniformity
Clean-room compatible handling

Applications
Oxygen evolution reaction (OER)
Hydrogen evolution reaction (HER)
Electrochemical catalysis research
Electrode platform development
Electroplating and seed layer studies
Energy storage research

Quality & Packaging
Uniform film thickness control
Research-grade surface quality
Protective packaging to reduce oxidation exposure

Custom wafer sizes and thicknesses available upon request.