Hexagonal Boron Nitride (h-BN) Transferred onto PET Substrate (1 cm x 1 cm)

Hexagonal Boron Nitride (h-BN) Transferred onto PET Substrate (1 cm x 1 cm)

CAS Number: 10043-11-5

Preparation Method:
Hexagonal boron nitride (h-BN) films are first grown on copper foils using a high-temperature Chemical Vapor Deposition (CVD) process. These high-quality h-BN films are then carefully transferred onto flexible PET (polyethylene terephthalate) substrates using a PMMA-assisted wet chemical transfer technique, ensuring uniform films with minimal defects. Morphology Options:
Monolayer
Few Layers (<10 layers, ~5 nm) Multilayer (>5 nm)
All options are available at the same price. For specific requirements, please contact us directly.

Substrate Options:
h-BN films are transferred onto flexible PET substrates, making them suitable for applications requiring lightweight, transparent, and flexible materials. Custom transfer to other substrate materials is available upon request-please visit our Custom Products page or contact us for assistance.

Fundamental Properties:
Hexagonal boron nitride (h-BN) on PET substrates retains its excellent chemical, thermal, and insulating properties while leveraging the flexibility and transparency of PET. Key properties include:
Chemical Stability: High resistance to oxidation and chemical degradation.
Thermal Stability: Withstands high temperatures and complements the thermal stability of PET.
Wide Bandgap: Exceptional dielectric properties with a bandgap of ~5.9 eV. Flexibility and Transparency: The PET substrate adds lightweight, transparent, and flexible characteristics, ideal for advanced applications.

Applications:
Flexible Electronics: Excellent as a dielectric layer or insulating substrate for flexible circuits and wearable devices.
Optoelectronics: Suitable for transparent electronics, UV detectors, and light-emitting devices.
Sensors: A chemically stable insulating material for flexible gas and biosensors. Energy Applications: Useful as a protective or insulating layer in flexible energy storage and conversion devices.
Thermal Management: Ideal for applications requiring flexible thermal insulation or heat dissipation.