Tin (Sn) Sputtering Target, 99.999% (5N) Purity, Circular

Tin (Sn) Sputtering Target, 99.999% (5N) Purity, Circular (Price Upon Request)

Tin (Sn) sputtering target is a metallic PVD source material for magnetron sputtering, ion sputtering, and laboratory thin-film deposition. It is supplied in circular target formats for research, development, and small-batch process work where clean handling, stated dimensions, and material identity are specified. Pricing for this material is provided upon request because final cost depends on current material market conditions and selected dimensions.

Features

Source Material
Supplied at 99.999% (5N) purity for thin-film workflows that require controlled source composition for deposition work.

Circular Target Formats
Available in circular diameters including 1 inch diameter (25.4 mm), 1.97 inch diameter (50 mm), 2 inch diameter (50.8 mm), 2.36 inch diameter (60 mm), 3 inch diameter (76.2 mm), 3.15 inch diameter (80 mm), 4 inch diameter (101.6 mm), 3.94 inch diameter (100 mm). Thickness options include 3 mm thick, 4 mm thick, 5 mm thick, 6 mm thick, 6.35 mm thick, depending on the selected diameter and target configuration.

Controlled Processing and Inspection
Target preparation may include material selection, forming, heat treatment, precision machining, dimensional inspection, surface finishing, cleaning, and final review. Composition and impurity control may be supported by analytical methods such as ICP, GDMS, carbon/sulfur analysis, oxygen/nitrogen analysis, and metallographic inspection where appropriate.

Clean Handling and Packaging
Targets are prepared for deposition use with clean surface handling and protective packaging. Store sealed in a dry environment, handle with clean gloves, and avoid direct contact with oil, dust, moisture, or other surface contamination before installation.

Material Properties and Technical Indicators

The following material-property values are provided as reference technical indicators for material selection, source loading, process planning, and thin-film deposition evaluation:

– Element symbol: Sn
– CAS number: 7440-31-5
– Physical state: solid
– Melting point: 231.93 °C
– Boiling point: 2602 °C
– Thermal expansion coefficient: (25 °C) 22.0 µm·m⁻¹·K⁻¹
– Thermal conductivity: 66.8 W·m⁻¹·K⁻¹
– Electrical resistivity: (0 °C) 115 nΩ·m
– Young’s modulus: 50 GPa
– Shear modulus: 18 GPa
– Bulk modulus: 58 GPa
– Mohs hardness: 1.5
– Poisson’s ratio: 0.36
– Brinell hardness: 350 MPa

Common Applications

– tin metal thin-film deposition; solder and alloy film development; electrode and contact research; Sn-based functional coating studies
– Academic, industrial, and pilot-scale thin-film process development