Cu Foam is an open-cell, three-dimensional copper substrate that provides a continuous conductive network with high void volume. It is used as a current collector, catalyst support, or freestanding working electrode in aqueous and non-aqueous electrochemical systems. Sheets are supplied flat in several footprint and thickness combinations so the substrate can be matched to the cell geometry before cutting and cleaning.
Key Features
- Pore size: 100PPI
- Porosity: ~96.6%
- Areal density: 600 g/m²
Specifications
| Pore size | 100PPI |
| Porosity | ~96.6% |
| Areal density | 600 g/m² |
| Available options | 100 100 1.6, 100 100 1.5, 100 100 1, 100 100 0.5, 100 100 0.3, 100 100 20, 100 100 15, 100 100 10, 100 100 6, 100 100 5, 100 100 3, 100 100 2, 200 300 5, 200 300 3, 200 300 2, 200 300 1.6, 200 300 1.5, 200 300 1 |
Copper foam is used in electrocatalysis, carbon dioxide reduction studies, gas-evolving reactions, and battery and supercapacitor research. The electrode has an open architecture. The material can be cut to size, cleaned, and loaded with active material before assembly into a cell.
Related products
-
Ni Foam
Price range: $90.49 through $1,872.53 -
Gold Plate
Price range: $240.85 through $602.83 -
Pt Plate
Price range: $98.85 through $1,879.49