Tungsten (W) Wire, 99.95% Purity (Request Current Price)

Tungsten (W) Wire, 99.95% Purity (Request Current Price)

Tungsten (W) wire is a thin-film and materials-research source format supplied for PVD source loading, evaporation-related workflows, filament or wire studies, alloy preparation, and laboratory materials development. The wire and rod formats support cutting and weighing, fixture loading, and small-batch experimental work where material identity, purity, and clean handling are specified. Pricing requires a current quote because wire and rod costs vary with purity, diameter, package size, and material market conditions.

Features

Source Material
Available purity options include 99.95% (3N5) for research workflows that require controlled source composition.

Wire and Rod Form Factor
Available diameter and rod-size options include 0.0118 in dia (0.3 mm) wire, 0.0197 in dia (0.5 mm) wire, 0.0394 in dia (1 mm) wire, 0.0236 in dia (0.6 mm) wire. Package options include 1 kg depending on selected purity and size.

Clean Handling and Storage
Store sealed in a dry environment. Handle with clean gloves or tweezers and avoid contact with oils, dust, moisture, or other contaminants before use.

Technical Specifications

Material: Tungsten (W)
Form: Wire
Purity Options: 99.95% (3N5)
Available Size Options: 0.0118 in dia (0.3 mm) wire, 0.0197 in dia (0.5 mm) wire, 0.0394 in dia (1 mm) wire, 0.0236 in dia (0.6 mm) wire
Package Options: 1 kg
Category: Wires & Filaments
Typical Use: PVD source loading, wire evaporation research, filament-related studies, alloy preparation, and laboratory materials science

Material Properties and Technical Indicators

The following material-property values are provided as reference technical indicators for material selection, source loading, process planning, and thin-film deposition evaluation:

– Element symbol: W
– CAS number: 7440-33-7
– Density: 19.25 g·cm⁻³
– Physical state: solid
– Melting point: 3415 °C
– Boiling point: 5660 °C
– Heat of fusion: 35.3 kJ·mol⁻¹
– Heat of vaporization: 806.7 kJ·mol⁻¹
– Specific heat capacity: 24.27 J·mol⁻¹·K⁻¹
– Crystal structure: body-centered cubic
– Thermal expansion coefficient: (25 °C) 4.5 µm·m⁻¹·K⁻¹
– Thermal conductivity: 173 W·m⁻¹·K⁻¹
– Electrical resistivity: (20 °C) 52.8 nΩ·m
– Young’s modulus: 411 GPa
– Shear modulus: 161 GPa
– Bulk modulus: 310 GPa
– Brinell hardness: 2570 MPa
– Mohs hardness: 7.5
– Poisson’s ratio: 0.28

Quality-Control and Handling Indicators

– Analytical checks: ICP-MS trace-element analysis; ICP impurity/composition analysis; GDMS trace-metal analysis; carbon/sulfur impurity analysis; nitrogen/oxygen impurity analysis.
– Inspection focus: surface cleanliness measurement; micrometer dimensional inspection; appearance inspection; dimensional verification.
– Handling and storage: sealed dry storage and protective packaging; clean-glove handling to avoid oil, dust, moisture, and surface contamination; careful handling to prevent compression, impact, or chipping.

Common Applications

– tungsten wire source loading and filament-related research
– refractory metal thin-film studies
– high-temperature materials development
– laboratory PVD and evaporation process evaluation
– Academic, industrial, and pilot-scale materials research