SiO₂ Single Crystal Substrate
Physical Properties:
– Crystal Structure: Hexagonal System
– Lattice Parameters: a=4.914 Angstrom, c=5.405 Angstrom
– Density: 2.65 g/cm³
– Melting Point: 1700 °C (Phase transition temp 573.1°C)
– Hardness: 7 (Mohs)
– Growth Method: Hydrothermal
Standard Specifications:
1. Orientation / Cut
– Z-cut (001), X-cut (110), Y-cut (100): miscut < 0.3°
– ST-cut, AT-cut: Available
2. Edge Orientation
– Available
3. Surface Quality
– Surface Roughness: Ra < 0.5 nm (CMP)
– Polish: Single-side polished / Double-side polished
| Option 1 | 10 × 10 × 0.5 mm, X-cut (110), Double-Side Polished, 10 × 10 × 0.5 mm, X-cut (110), Single-Side Polished, 10 × 10 × 0.5 mm, Y-cut (100), Double-Side Polished, 10 × 10 × 0.5 mm, Y-cut (100), Single-Side Polished, 10 × 10 × 0.5 mm, Z-cut (001), Double-Side Polished, 10 × 10 × 0.5 mm, Z-cut (001), Single-Side Polished, 5 × 5 × 0.5 mm, X-cut (110), Double-Side Polished, 5 × 5 × 0.5 mm, X-cut (110), Single-Side Polished, 5 × 5 × 0.5 mm, Y-cut (100), Double-Side Polished, 5 × 5 × 0.5 mm, Y-cut (100), Single-Side Polished, 5 × 5 × 0.5 mm, Z-cut (001), Double-Side Polished, 5 × 5 × 0.5 mm, Z-cut (001), Single-Side Polished |
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