Silver-Coated Silicon Substrates (Ag/Cr on Si (100))

Silver-Coated Silicon Substrates (Ag/Cr on Si (100))

Overview
Our silver-coated silicon chips are precision-cut from research-grade Ag thin film wafers fabricated on Si (100) substrates using high-vacuum magnetron sputtering. The controlled deposition process ensures high film uniformity, high reflectivity, and smooth surface morphology.

A 5 nm chromium (Cr) adhesion layer is deposited between the silicon substrate and the silver film to has strong interfacial bonding while maintaining standard optical performance.

These silver-coated chips are applicable for plasmonics research, SERS applications, and optical reflectivity studies.

Available Sizes & Thickness
Standard chip sizes:
5 × 5 mm
10 × 10 mm

Standard silver thickness options:
100 nm (Recommended)
200 nm (Recommended)
500 nm

Custom sizes and thicknesses available upon request.

Layer Structure
Ag (Silver layer)
Cr (5 nm adhesion layer)
Si (100) substrate

Substrate Specifications
Orientation: Si (100)
Doping: N-type, 1–10 Ω·cm resistivity
Surface finish: Single-side polished (SSP)

Custom substrate options available upon request.

Deposition & Processing
High-vacuum magnetron sputtering
Controlled film thickness uniformity
Precision wafer dicing
Clean-room fits handling

Each chip is carefully cleaned and packaged to minimize contamination and reduce oxidation exposure.

Applications
Surface-modified Raman spectroscopy (SERS)
Plasmonic device research
Optical reflectivity testing
Photonic structures
Micro/nano-fabrication platforms

Quality & Packaging
Uniform film thickness control
High surface reflectivity
Protective packaging to reduce oxidation
Research-grade surface quality

Custom Orders
We support custom chip dimensions, custom silver thickness, alternative adhesion thickness, and patterned silver structures.

Contact us for academic pricing and technical consultation.