Indium Foil
Application: Indium Source Precursor, Electronic Heat Dissipation/Cooling Material, Semiconductor Applications
Product Overview: This indium foil is characterized by its low melting point, low electrical resistance, thermal and electrical conductivity. It is used in the electronics and wireless communications industries.
Key Specifications:
Purity: > 99.99%
Melting Point: 156 ± 1°C
Thermal Conductivity: 84 W/(m-K)
Electrical Resistivity: 8.4 x 10⁻⁸ Ohm-m
Trace Impurities (Representative Values in ppm):
– Aluminum (Al): 4.9
– Lead (Pb): 5
– Cadmium (Cd): 4.9
– Thallium (Tl): 5
– Copper (Cu): 5
– Arsenic (As): 5
– Iron (Fe): 5
– Tin (Sn): 5
– Zinc (Zn): 5
Dimensions: 100 mm x 100 mm x 0.1 mm
Packaging Unit: Sheet
Storage & Handling:
– Packaging: Vacuum sealed.
– Usage Recommendation: Use within one week after opening the vacuum seal.
– Storage Conditions: Store in a dry environment at a temperature below 10°C.
| Option 1 | 0.1 mm T x 100 mm W x 100 mm L, Purity 99.99%, Sheet |
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