Wafer bonding is a high-precision process that unites two meticulously cleaned, atomically smooth surfaces of either identical or different semiconductor materials. Through careful surface preparation and activation, wafers are bonded under controlled conditions using van der Waals forces, molecular interactions, or atomic bonding, resulting in a seamless, unified structure. We offer a range of advanced bonding techniques to support diverse materials and application needs.
Anodic Bonding: Ideal for creating strong, hermetic seals between silicon and glass, metal and glass, semiconductor and alloy, or semiconductor and glass interfaces—crucial for high-reliability applications.
Eutectic Bonding: Suitable for low-melting-point bonding with materials like PbSn, AuSn, CuSn, and AuSi, delivering superior mechanical and electrical properties for MEMS and semiconductor devices.
Adhesive Bonding: Utilizing specialized adhesives such as AZ4620 and SU8, this flexible bonding solution is compatible with 4-inch and 6-inch wafers, supporting a range of materials and device types.
©2025 Nano store