Description
Hexagonal Boron Nitride (h-BN) Transferred onto Sapphire Substrate (1 cm × 1 cm)
CAS Number: 10043-11-5
Preparation Method:
Hexagonal boron nitride (h-BN) films are grown on copper foils using a high-temperature Chemical Vapor Deposition (CVD) process. These high-quality h-BN films are then carefully transferred onto sapphire substrates using a PMMA-assisted wet chemical transfer technique, ensuring uniform films with minimal defects and excellent surface quality.
Morphology Options:
Monolayer
Few Layers (<10 layers, ~5 nm) Multilayer (>5 nm)
All options are available at the same price. For specific requirements, please contact us directly.
Substrate Options:
h-BN films are transferred onto sapphire substrates, which provide excellent thermal, optical, and mechanical stability. Custom transfer to other substrate materials is available upon request—please visit our Custom Products page or contact us for assistance.
Fundamental Properties:
Hexagonal boron nitride (h-BN) on sapphire substrates combines the exceptional dielectric, thermal, and chemical stability of h-BN with the robust and optically transparent properties of sapphire.
Key properties include:
Chemical Stability: High resistance to oxidation and chemical degradation.
Thermal Stability: Withstands extreme temperatures, complementing sapphire’s high thermal conductivity.
Wide Bandgap: Exceptional dielectric properties with a bandgap of ~5.9 eV.
Optical Transparency: The sapphire substrate is highly transparent in the UV and visible regions, enabling advanced optical applications.
Applications:
Electronics: Ideal as a dielectric layer or insulating substrate for high-performance electronic devices.
Optoelectronics: Suitable for transparent electronics, UV detectors, and other light-emitting devices.
Sensors: A chemically stable insulating material for gas and chemical sensing applications.
Energy Applications: Useful as a protective or insulating layer in high-temperature energy storage and conversion devices.
Thermal Management: Ideal for applications requiring thermal insulation or efficient heat dissipation.
Additional information
| CAS Number | 10043-11-5 |
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