Description
Hexagonal Boron Nitride (h-BN) Transferred onto PET Substrate (1 cm × 1 cm)
CAS Number: 10043-11-5
Preparation Method:
Hexagonal boron nitride (h-BN) films are first grown on copper foils using a high-temperature Chemical Vapor Deposition (CVD) process. These high-quality h-BN films are then carefully transferred onto flexible PET (polyethylene terephthalate) substrates using a PMMA-assisted wet chemical transfer technique, ensuring uniform films with minimal defects.
Morphology Options:
Monolayer
Few Layers (<10 layers, ~5 nm) Multilayer (>5 nm)
All options are available at the same price. For specific requirements, please contact us directly.
Substrate Options:
h-BN films are transferred onto flexible PET substrates, making them suitable for applications requiring lightweight, transparent, and flexible materials. Custom transfer to other substrate materials is available upon request—please visit our Custom Products page or contact us for assistance.
Fundamental Properties:
Hexagonal boron nitride (h-BN) on PET substrates retains its excellent chemical, thermal, and insulating properties while leveraging the flexibility and transparency of PET.
Key properties include:
Chemical Stability: High resistance to oxidation and chemical degradation.
Thermal Stability: Withstands high temperatures and complements the thermal stability of PET.
Wide Bandgap: Exceptional dielectric properties with a bandgap of ~5.9 eV.
Flexibility and Transparency: The PET substrate adds lightweight, transparent, and flexible characteristics, ideal for advanced applications.
Applications:
Flexible Electronics: Excellent as a dielectric layer or insulating substrate for flexible circuits and wearable devices.
Optoelectronics: Suitable for transparent electronics, UV detectors, and light-emitting devices.
Sensors: A chemically stable insulating material for flexible gas and biosensors.
Energy Applications: Useful as a protective or insulating layer in flexible energy storage and conversion devices.
Thermal Management: Ideal for applications requiring flexible thermal insulation or heat dissipation.
Additional information
| CAS Number | 10043-11-5 |
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