Our MEMS thin-film deposition services offer high-quality coatings tailored for advanced applications in microelectronics, optoelectronics, and sensor technology. We provide a wide selection of both metallic and non-metallic materials, with deposition methods optimized for precision and consistency across various substrates.
Deposition Materials:
Metals: Ti, Al, Ni, Au, Ag, Cr, Pt, Cu, TiW (90), Pd, Zn, Mo, W, Ta, Nb, and more.
Non-metals: Si, SiO₂, SiNx, Al₂O₃, HfO₂, MgF₂, ITO, Ta₂O₅, among others.
Substrate Compatibility:
Silicon wafers, quartz glass, sapphire, PET, PI, and other substrates.
Electron Beam Evaporation: For high-purity thin films with excellent control over thickness and uniformity.
Magnetron Sputtering: Ideal for uniform coatings with strong adhesion across complex surfaces.
Low-Pressure Chemical Vapor Deposition (LPCVD): Ensures high-quality thin films with precise layer control.
Plasma-Enhanced Chemical Vapor Deposition (PECVD): Enables low-temperature deposition for thermally sensitive materials.
Atomic Layer Deposition (ALD): Provides ultra-thin, conformal coatings with atomic-level precision.
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